High purity cresol formaldehyde resin
PD-1672 is used in semiconductor photoresist applications
Target Value |
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PD-1672 Slow |
PD-1672 |
PD-1672 Fast |
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Appearance |
Crushed solid |
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Bulk dissolution rate, 2.38% TMAH developer, PAB 110°C/60 seconds |
ca. 60 - 140Å/sec |
ca. 50 - 200Å/sec |
ca. 140 - 240Å/sec |
Average molecular weight, GPC |
ca. 9000 – 14000 g/mol |
ca. 7000 – 14000 g/mol |
ca. 6000 – 10000 g/mol |
Free cresol content, GC |
max 1.0% |
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Individual trace metal content, GFAA |
max 500 ppb |
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Karl Fisher water content |
max 0.5% |
Tests are made in accordance with the current Hexion Standard Test Method and are available upon request.The typical properties provided are examples of product attributes and may not be tested.