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Momentive
Americas

 NextGen Epoxy™ Waterborne System
 Liquid Epoxy Resins & Blends
 Epoxy Resin Solutions
 Technical Data Sheets
 Solid & Powder Grade Resins
 Multi-Functional & Specialty Resins
 Epoxy Functional Modifiers
 Epoxy Waterborne Resins & Curing Agents
 Curing Agents for Epoxy Resins
 Epoxy Casting Systems
 Epoxy Composites for Automotive
 Epoxy Systems for Wind Energy
 Epoxy Vinyl Ester Resins
 Epoxy Precursors - BPA, ECH, and AC

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 Starting Formulations
 Shelf Life
 All Technical Data Sheets
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Epoxy Resin Solutions

Technical Data Sheets 



ProductDescription
EPIKOTE Resin 874L-X-90EPIKOTE Resin 874L-X-90 is a Bisphenol-A epoxy resin solution that has been modified to improve flexibility and to reduce solution viscosity.
EPON Resin 834-F-90

For Ambient Cure Applications - Epoxy resin solution, 90% solids in normal butyl alchol.

EPON Resin 834-X-90

For Ambient Cure Applications - Epoxy resin solution, 90% solids in xylene.

EPON Resin 872-X-75

Provides varying degrees of flexibility and toughness.

 

EPON Resin 874-CX-90

For Ambient Cure Applications - Epoxy resin solution, 90% solids in MIBK/xylene.

EPON Resin 1001-B-80

EPON™ Resin 1001-B-80 is a 80 percent solids solution of an EPON 1001F type epoxy resin in methyl ethyl ketone.

EPON Resin 1001-CX-75

For Ambient Cure Applications - Resin solution, 75% solids in MIBK/xylene.

EPON Resin 1001-H-75

For Ambient Cure Applications - Resin solution, 75% solids in PGME

EPON Resin 1001-K-65

For Ambient Cure Applications - Resin solution, 65% solids in tertiary-butyl acetate.

EPON Resin 1001-O-75

For Ambient Cure Applications - Resin solution, 75% solids in MNAK.

EPON Resin 1001-T-75

For Ambient Cure Applications - Resin solution, 75% solids in toluene.

EPON Resin 1001-X-75For Ambient Cure Applications -

Epoxy resin solution, 75% solids in xylene.

EPON Resin 1001-UY-70

For Ambient Cure Applications - Resin solution, 75% solids in aromatic solvent 100 / 2-propoxyethanol.

EPON Resin 8521-MX-60

For Ambient Cure Applications - Epoxy resin solution, 60% solids in EGBE/xylene.

EPON Resin CS-267

CS-267 is a 65%w solution of a modified fusion derived solid bisphenol A/epichlorohydrin epoxy resin thinned in a 1:1 blend of propylene glycol methyl ether acetate and toluene.

EPON Resin CS-373

CS-373 is a one-pack, dicy-free, brominated epoxy resin and curing agent solution supplied as 70% by weight solids in a blend of methyl ethyl ketone (MEK) and propylene glycol monomethyl ether (PGME).

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