EPON™ Electrical Laminating resins are used in the preparation of Printed Circuit Boards (PCB's), and their prepregs and copper clad laminates. A wide range of Hexion products are available for 150 to 180ºC Glass Transition Temperature (Tg) applications. These products use reactive halogen containing materials to impart flammability resistance to PCB's. They may be cured using either Dicycanamide (DICY) or novolac curing agents. Both one-part (resin plus novolac curing agent) and two-part (resin, with DICY or novolac curing agent in the second package) resin systems are available. The novolac cured electrical laminating resins meet the requirements of "Lead-Free" PCB processing. They also offer excellent thermal stability, good Conductive Anodic Filament (CAF) resistance and fast processing. Low Halogen content UL V0 and V1 flammability rating resins and very high Tg laminating resins (for Chip On Board) applications are also available.
In addition, high molecular weight brominated epoxy oligomeric resins are available for use as flame retarding agents for thermoplastic polymers.
See the "Technical Data Sheets" section for information on individual products.
EPON electrical laminating resins are used primarily for preparing flame retarded PCB's with DICY or novolac curing agents. High molecular weight brominated epoxy oligomers from Hexion can also be used as flame retarding agents for thermoplastic polymers.
See the "Applications & Formulations" section for Starting Formulations and additional information.
- EPON resin products are available in drum quantities through our extensive distributor network.
- Larger quantities are available directly from Hexion by contacting a Customer Service representative.