Hexion’s Bakelite® family of phenolic resins are proven in a broad range of applications and are the industry-standard in areas as diverse as refractories and composite parts for rail interiors. With over 100 years of formulation expertise, we can also optimize our resin products to fit your specific application requirements and take your process to the next level.
Bakelite® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide high temperature stability, increased moisture resistance, low electrical conductivity and better copper adhesion.
Our technical expertise allows us to support customers by tailoring the resin’s softening point, hydroxyl equivalent, glass transition temperature, molecular weight and viscosity to meet specific application requirements.
Additional products are available for this application. Please contact Customer Service for information.