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  • Unmatched Phenolic Resin Application Expertise

    Hexion’s Bakelite® family of phenolic resins are proven in a broad range of applications and are the industry-standard in areas as diverse as refractories and composite parts for rail interiors. With over 100 years of formulation expertise, we can also optimize our resin products to fit your specific application requirements and take your process to the next level. 

       Bakelite Phenolic Resin Applications 3
  •  Bakelite®-Phenolic-Resins-for-Electronics-Applications 

     

    Bakelite® Phenolic Resins for Electronics Applications

    Bakelite® and Durite™ phenolic resins are ideal for the production of high-quality copper-clad laminates and semiconductor photoresist formulations.   

     

  • Bakelite-Phenolic-Resins-for-Printed-Circuit-Board-Assembly

     

    Heat and Moisture Resistant Resin Systems for PCB Assembly

    Bakelite® and Durite™ high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide high temperature stability, increased moisture resistance, low electrical conductivity and better copper adhesion.

    Our technical expertise allows us to support customers by tailoring the resin’s softening point, hydroxyl equivalent, glass transition temperature, molecular weight and viscosity to meet specific application requirements.

     

    ProductBenefit
     Reduced ColorImproved Moisture ResistanceLow Dielectric ConstantGood Adhesion to MetalsHigh Temperature StabilityFlexible in Various Formulations
    Durite
    SD-1508
          
    Durite
    D_SD-1809
          
    Durite
    SL-150B
          
    Durite
    SD-1731
          
    Durite
    SD-1817
          
    Durite
    SD-241A
          

     

    Additional products are available for this application. Please contact Customer Service for information.